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SCIEN Colloquium and EE 292E: Insider's View on Pixel Design

Summary
Dr. Dan McGrath (Senior Consultant)
Packard 101
Jan
2023
Date(s)
, -
Content

Talk Abstract: The success of solid state image sensors has been the cost-effective integration of mega-arrays of transducers into the design flow and manufacturing process, similar to the way integrated circuits have thrived in our industry, This talk will provide a front-line designer’s perspective on some key challenges that have been overcome and those that still exist in terms of device physics, integration, manufacturing, and meeting customer expectations.

 

Speaker Biography:  Dan McGrath has worked for over 40 years specializing in the device physics of pixels, both CCD and CIS, and in the integration of image-sensor process enhancements in the manufacturing flow. He received his doctorate in physics from John Hopkins University. He chose his first job because it offered that designing image sensors “means doing physics” and has kept this passion front-and-center in his work. He has worked at Texas Instruments, Polaroid, Atmel, Eastman Kodak, Aptina, BAE Systems and GOODiX Technology and with manufacturing facilities in France, Italy, Taiwan, China and the USA. He has been involved with astronomers on the Galileo mission to Jupiter and to Halley’s Comet, with commercial companies on cell phone imagers and biometrics, with scientific community for microscopy and lab-on-a-chip, with robotics on 3-d mapping sensors and with defense contractors on night vision.  His publications include the first megapixel CCD and the basis for dark current spectroscopy (DCS).

 

We hope you can join us in person, but if this is not possible, you can join online by registering in advance for this meeting.

After registering, you will receive a confirmation email containing information about joining the meeting