Abstract: AIM Photonics, a Department of Defense (DoD) Manufacturing Innovation Institute (MII), offers end-to-end services in photonic integrated circuits (PICs), interposers, heterogeneous integration (HI), electronic photonic design automation (EPDA), and packaging. AIM Photonics leverages the 300 mm Albany NanoTech Complex and the Test Assembly and Packaging (TAP) facility in Rochester, NY, to provide these state-of-the-art capabilities. As a DoD MII, AIM Photonics’ mission is to advance the photonics and packaging industries to help improve the U.S. ecosystem and build a skilled workforce.

This talk will focus on how AIM Photonics is accomplishing its mission. To help advance the ecosystem, AIM Photonics offers interposer technologies and the two fundamental PIC technologies: Base Multi-Project Wafer (MPW) and SiN MPW, which are optimized for sensors. In addition to the current offerings, AIM Photonics will soon offer a Quantum Flex (QFlex) MPW optimized for quantum applications.

Because of the challenges in photonic packaging, packaging PIC chips into functional optoelectronic systems has not fully incorporated the advances made in electronic packaging. Addressing these challenges will require a coordinated development of PIC fabrication processes and packaging technologies. An end-to-end development cycle that includes the PIC and packaging is critical. This talk will discuss the AIM Photonics ecosystem and provide specific examples to illustrate co-processing and co-design.

Another challenge that AIM Photonics is addressing is the development of a skilled workforce. This talk will share an overview of our education and workforce development programs, which aim to build a qualified workforce to support the U.S. ecosystem.

Biography: David Harame received his Ph.D. in Electrical Engineering from Stanford University. He is the COO for AIM Photonics and the Associate Vice President managing photonics, electronic photonic design automation, test, assembly, and packaging technical areas. He has been with AIM Photonics since 2019. In his current position, David Harame manages all the technology development in the photonics and packaging areas for AIM Photonics in Albany, NY, at the Albany NanoTech Center and Rochester, NY, at the Test Assembly and Packaging facility.

Prior to joining AIM Photonics, David Harame was a GLOBALFOUNDRIES Fellow and CTO for Development and Enablement. David was an IBM Fellow and CTO for Development and Enablement at IBM before joining GLOBALFOUNDRIES. David Harame is an IEEE Fellow and received the IEEE Daniel E. Noble Award in Emerging Technologies “For the development of manufacturable Silicon Germanium, HBT Bipolar and BiCMOS technologies.” David is best known for his work bringing SiGe BiCMOS into manufacturing. David also worked on foundry enablement and technology development for RF CMOS, RF PD, and FD SOI technologies.