Abstract: The upcoming 3D PRODIGY (Three-Dimensional Placement and Routing for Densely Integrated Gate-level Systems) program at DARPA MTO will create the first tools to generate manufacturing-ready layout designs for digital 3D ICs from gate-level circuit schematics automatically. The goal is to ensure that this auto-translation is done fast for large-scale designs, while producing high-performance designs that exploit the full potential for high-density 3D interconnects and stay within thermal and electrical limits. Performers are invited from academia, EDA vendors, defense industry, and commercial industry to (1) develop innovative EDA solutions that overcome technical challenges in fine-grain 3D IC physical design, (2) disseminate the technologies to designers for hands-on experience, and (3) demonstrate the benefits using defense and commercial use cases. In this talk, we present the details of the program along with case studies that have the potential to become successful projects.

Bio: Dr. Sung Kyu Lim joined DARPA in August 2022 as a program manager in the Microsystems Technology Office (MTO). He has previously served as the principal investigator for multiple DARPA programs. While serving at DARPA, he continues his role as the Motorola Solutions Foundation Professor at Georgia Institute of Technology’s School of Electrical and Computer Engineering. Dr. Lim received his doctorate degree from the University of California, Los Angeles in 2000. Lim’s research focus is on architecture, design, and electronic design automation (EDA) for 2.5D and 3D integrated circuits. He has published more than 400 papers on the topics. He received the Best Paper Award from the IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems in 2022. He is an IEEE fellow.