Electrical Engineering Department News

E.g., 2017-12
Photo credit, The Marconi Society
August 2017
Honored for his transformative contributions to information and system science and his sustained mentoring and development of new generations of scientists.
Professor Lambertus 'Bert' Hesselink
August 2017
The IEEE VIS Test of Time award recognizes articles published at previous conferences whose contents are still vibrant and useful today and have had a major impact and influence within and beyond the visualization community.
August 2017
​Among other virtues, silicon “rusts” in a way that insulates a chip's circuitry. Two new ultrathin materials share that trait and others vital to the future of electronics.
August 2017
EE staff recognized for their extraordinary work.
Orly Liba (PhD candidate ’18)
July 2017
Their approach reveals features that are otherwise obscured by speckle noise when using conventional OCT or OCT with current state of the art speckle reduction methods.
July 2017
Saurabh Suryavanshi and Alex Gabourie are part of the Pop Lab
Professor Gordon Wetzstein, left; postdoctoral research fellow Donald Dansereau (Image credit: L.A. Cicero)
July 2017
The first single-lens, wide field of view, light field camera prototype is being presented this week.
July 2017
For his presentation titled, "High-field transport and velocity saturation in CVD monolayer MoS2."
Yuanfang Li and Dr. Ardavan Pedram: Best Paper Award, IEEE ASAP
July 2017
For their paper titled, “CATERPILLAR: Coarse Grain Reconfigurable Architecture for Accelerating the Training of Deep Neural Networks"
July 2017
Silicon chips are single story, but using new semiconductor materials, engineers can stack computer logic and memory like floors in a building to bust data traffic jams.

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