EE Student Information

Electronic Systems Technology Seminar Talk: Radio Frequency Acoustic Microsystems for Front End Signal Processing

Radio Frequency Acoustic Microsystems for Front End Signal Processing
Thursday, January 6, 2022 - 12:00pm
Prof. Ruochen Lu (Univ of Texas at Austin)
Abstract / Description: 

The development of 5G wireless communication is calling for unprecedented signal processing over a large bandwidth and at high frequencies. Acoustic microsystems, because of their compact size and low damping, are highly sought after for chip-scale wireless applications. However, acoustic elements in modern mobile devices are mostly limited to resonators and filters, due to the long-standing challenge of efficiently accessing the acoustics over a sufficiently wide bandwidth. This talk will first focus on the recent development of wideband, low-loss acoustic platforms using thin film lithium niobate, followed by the discussion on implementing various high-performance miniature acoustic components, including couplers, circulators, and filters.

Bio: Ruochen Lu is an Assistant Professor in the Department of Electrical and Computer Engineering at The University of Texas at Austin. His research primarily focuses on developing chip-scale acoustic and electromagnetic components and microsystems for RF applications. His works aim to demonstrate reconfigurable and tunable RF functions using novel MEMS platforms, toward higher operating frequencies and more efficient transduction between the EM and acoustic domains. In addition, he works on ultrasonic transducers and multi-physics hybrid microsystems for signal processing, sensing, and computing applications. He received the B.E. degree with honors in microelectronics from Tsinghua University, Beijing, China, in 2014, and the M.S. and Ph.D. degree in electrical engineering from the University of Illinois at Urbana-Champaign, Urbana, IL, USA, in 2017 and 2019, respectively. He received the Best Student Paper Awards at the 2017 IEEE International Frequency Control Symposium, and 2018 IEEE International Ultrasonics Symposium.