||A. L. Lentine, K. W. Goossen, J. A. Walker, L. M. F.
Chirovsky, L. A. D'Asaro, S. P. Hui, B. T. Tseng, R. E. Leibenguth, D. P. Kossives, D. W.
Dahringer, D. D. Bacon, T. K. Woodward, D. A. B. Miller, "Arrays of
Optoelectronic Switching Nodes Comprised of Flip-Chip-Bonded MQW Modulators and Detectors
on Silicon CMOS Circuitry" IEEE Photonics Technology Letters, 8, 221-223
We describe 8*8 arrays of smart pixels, designed and fabricated using MQW
modulators and detectors flip-chip-solder-bonded to silicon CMOS circuits. The individual
circuits implement 2 input, 1 output embedded control switching nodes. Four arrays from
two different designs were fabricated and tested. For the array with the highest yield, 60
of 64 nodes functioned correctly at low speeds and were tested up to 250 Mb/s without
re-adjusting individual bias voltages with the maximum speed of an individual node of 375
Mb/s. For the second-generation array, the center 4*8 section of the array was tested at
data rates beyond 700 Mb/s with individual nodes having short term bit error rates below
Full text available for